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Patent Searching and Data


Title:
EPOXY RESIN COMPOSITION FOR REPAIRING/REINFORCING CONCRETE STRUCTURE AND METHOD FOR REPAIRING/REINFORCING USING THE COMPOSITION
Document Type and Number:
Japanese Patent JP2003002948
Kind Code:
A
Abstract:

To provide an excellent epoxy resin composition for repairing/ reinforcing concrete structures, excellent in low temperature curability, cured at normal temperature in a short time, and to provide a method for repairing/ reinforcing using the composition.

This epoxy resin composition for repairing/reinforcing concrete structures comprises at least a ingredient [A] and [B] as a major ingredient, and a curing agent, wherein the major ingredient and the curing agent are liquid at a room temperature and one selected from the major ingredient and the curing agent is compounded with a particulate thixotropy-imparting agent. [A] A liquid bisphenol-type epoxy resin. [B] An epoxy resin derived from a 3-18C aliphatic polyol and having ≥0.5 alcoholic hydroxy and ≥2 epoxy per a molecule on average.


Inventors:
KAWACHI SHINJI
OOSETO HIROKI
MATSUDA MARIKO
Application Number:
JP2001186016A
Publication Date:
January 08, 2003
Filing Date:
June 20, 2001
Export Citation:
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Assignee:
TORAY INDUSTRIES
International Classes:
C08G59/20; E01D19/02; E01D19/12; E01D22/00; E01D21/00; E04G23/02; E01D101/40; (IPC1-7): C08G59/20; E01D21/00; E04G23/02
Domestic Patent References:
JP2000119375A2000-04-25
JP2000007956A2000-01-11
JPH1121430A1999-01-26
JPH1121335A1999-01-26
JP2000345006A2000-12-12