Title:
EPOXY RESIN COMPOSITION AND CURED ARTICLE PRODUCED THEREFROM
Document Type and Number:
Japanese Patent JPH05262851
Kind Code:
A
Abstract:
PURPOSE:To prepare the title compsn. which gives a cured article exhibiting a high heat resistance and a low moisture absorption by compounding a specific epoxy compd. with a specific phenol compd. CONSTITUTION:The title compsn. is prepd. by compounding 1 equivalent of an epoxy compd. of formula I (wherein R1 and R2 are each H, halogen, 1-4C alkyl, or aryl; and m is 0-10) with 0.5-1.5 equivalents of a phneol compd. of formula II (wherein R3 and R4 are each H, halogen, 1-4C alkyl, or aryl; and n is 0-10) as a curative. The compsn. gives a cured article exhibiting a high heat resistance and a low water absorption and is useful in the fields of electric and electronic materials, e.g. an insulating material, a laminate board, or a sealing material, and also in the fields of coating material.
Inventors:
Yasumasa Akatsuka
Shigeru Mogi
Hiromi Morita
Kenichi Kubotaki
Shigeru Mogi
Hiromi Morita
Kenichi Kubotaki
Application Number:
JP9492992A
Publication Date:
October 12, 1993
Filing Date:
March 23, 1992
Export Citation:
Assignee:
NIPPON KAYAKU KABUSHIKI KAISHA
International Classes:
C08G59/08; C08G59/00; C08G59/20; C08G59/62; C08L63/00; (IPC1-7): C08G59/20; C08G59/08; C08G59/62