Title:
EPOXY RESIN COMPOSITION, RESIN CURED PRODUCT, PREPREG AND FIBER REINFORCED COMPOSITE
Document Type and Number:
Japanese Patent JP2003201388
Kind Code:
A
Abstract:
To provide a fiber reinforced composite which is used in a fiber reinforced composite and excels in compression characteristics and flexural properties.
An epoxy resin composition comprises (A) an epoxy resin, (B) a curing agent, and (C) carbon short fibers as the constituting elements.
Inventors:
NODA SHUNSAKU
FUKUI HIROAKI
MIWA KISHIO
FUKUI HIROAKI
MIWA KISHIO
Application Number:
JP2002001151A
Publication Date:
July 18, 2003
Filing Date:
January 08, 2002
Export Citation:
Assignee:
TORAY INDUSTRIES
International Classes:
C08J5/04; C08G59/24; C08G59/50; C08J5/24; C08K7/06; C08L63/00; C08L101/02; (IPC1-7): C08L63/00; C08G59/24; C08G59/50; C08J5/04; C08J5/24; C08K7/06; C08L101/02
Previous Patent: EPOXY RESIN MOLDING MATERIAL AND ELEMENT HOUSING TYPE SEMICONDUCTOR PACKAGE
Next Patent: POLYESTER HOLLOW MOLDING
Next Patent: POLYESTER HOLLOW MOLDING