Title:
エポキシ樹脂組成物、その硬化物、光半導体封止用樹脂組成物、及び光半導体装置
Document Type and Number:
Japanese Patent JP5783209
Kind Code:
B2
More Like This:
Inventors:
Atsuko Kobayashi
Ichiro Ogura
Ichiro Ogura
Application Number:
JP2013131626A
Publication Date:
September 24, 2015
Filing Date:
June 24, 2013
Export Citation:
Assignee:
DIC Corporation
International Classes:
C08G59/20; H01L23/29; H01L23/31; H01L33/56
Domestic Patent References:
| JP59215312A | ||||
| JP4209648A |
Attorney, Agent or Firm:
Kono Tsuyo