PURPOSE: To obtain the subject composition excellent in moisture resistance and soldering resistance, little in the affection with absorbed moisture, reduced in the generation of the breakage of wires due to the corrosion of electrodes, and useful for sealing semiconductor chips, etc.

CONSTITUTION: This composition comprises (A) an epoxy resin of formula I, (B) a phenol resin of formula II [R1 is CkH2k+1; R2 is ClH21+1; R3 is CmH2m+1 ((k), (l), (m), (n) are 0 or an integer of ≥1)], and (C) an inorganic filler as essential components, the content of the component C being 25-90wt.% based on the resin composition.