EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR

Title:

EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR

Document Type and Number:

Japanese Patent JPS60161424

Kind Code:

A

Abstract:

PURPOSE: The titled composition useful for sealing semiconductor elements of LSI or VLSI, having extremely small internal stress during curing, high glass transition temperature and improved humidity resistance, obtained by blending a polyfunctional novolak epoxy resin with a specific curing agnet of novolak resin.

CONSTITUTION: (A) A polyfunctional novolak epoxy resin having ≥60°C curing point is blended with (B) a curing agnet of novolak 2,2-bis(4,4'-hydroxyphenyl) propane/phenol/formaldehyde resin (molar ratio of propane: phenol=50:50W100:0, and equivalent ratio phenolic hydroxyl group to 1 equivalent epoxy group in the component A of 0.7W1.3), or a curing agent of 2,2-bis(4'-hydroxyphenyl)propane/ formaldehyde resin, (C) a curing promotor, and (D) an inorganic filler.

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Inventors:

KATAYAMA MASATO
YOKOYAMA MINEO
YAMAMOTO HIDEAKI
ISHIGAKI AKIRA
INOUE HIDEO

Application Number:

JP1584784A

Publication Date:

August 23, 1985

Filing Date:

January 31, 1984

Export Citation:

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Assignee:

DAINIPPON INK & CHEMICALS

International Classes:

C08G59/00; C08G59/62; C08L63/00; H01B3/40; H01L23/29; H01L23/31; (IPC1-7): C08G59/62; H01B3/40; H01L23/30

Attorney, Agent or Firm:

Takahashi victory

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