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Title:
EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPS62100521
Kind Code:
A
Abstract:

PURPOSE: The titled composition providing a cured material having water vapor resistance and thermal shock resistance, containing an epoxy resin, novolak type phenolic resin, a high-viscosity polyolefin and a silicone oil in specific ratio, respectively.

CONSTITUTION: The aimed composition containing (A) 100pts.wt. epoxy resin (preferably 70W85°C softening point and 175W220 epoxy equivalent) containing at least two epoxy groups in one molecule, (B) 40W65pts.wt., preferably 45W55 pts.wt. novolak type phenolic resin (having preferably 80W100°C softening point and 100W110 OH group equivalent), (C) 2W30pts.wt., preferably 3W15pts.wt. polyolefin (having preferably ≤100μ average particle diameter) having 1,000,000W6,000,000, preferably 1,500, 000W4,500,000 viscosity-average molecular weight and (D) 1W30pts.wt. preferably 2W6pts.wt. silicone oil (having preferably 50,000W500,000cps).


Inventors:
YOSHIZUMI AKIRA
MATSUMOTO KAZUTAKA
UCHIDA TAKESHI
AZUMA MICHIYA
Application Number:
JP23754785A
Publication Date:
May 11, 1987
Filing Date:
October 25, 1985
Export Citation:
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Assignee:
TOSHIBA CORP
International Classes:
H01L23/29; C08G59/00; C08G59/62; C08L23/00; C08L63/00; C08L101/00; H01L23/31; (IPC1-7): C08G59/62; C08L63/00; H01L23/30
Attorney, Agent or Firm:
Hajime Tsukuni



 
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