Title:
EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2014156607
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an epoxy resin composition excellent in flame retardancy and moldability.SOLUTION: The epoxy resin composition used for covering, insulating, or sealing an electric component, an electronic component, or an integrated circuit contains as essential components an epoxy resin (A) represented by a prescribed general formula, phenolic resins ((B) and (C)) represented by prescribed general formulae, a curing accelerator (D), and an inorganic filler (E). The weight ratio [(B)/(C)] of (B) to (C) is 1-10.
Inventors:
UMIGA FUMIHIRO
Application Number:
JP2014087533A
Publication Date:
August 28, 2014
Filing Date:
April 21, 2014
Export Citation:
Assignee:
SUMITOMO BAKELITE CO
International Classes:
C08G59/62; C08K3/00; C08L63/00
Attorney, Agent or Firm:
Shinji Hayami
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