Title:
EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPH1192629
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To obtain the subject composition having high fluidity in molding and capable of providing a semiconductor device excellent in moldability, reliability and packaging property by combining a specific crystalline epoxy resin with a polyfunctional phenol resin curing agent. SOLUTION: This composition is obtained by compounding (A) an epoxy resin containing >=30 wt.% crystalline epoxy resin of formula I (R is H, a halogen or a 1-12C alkyl) (melting point: 50-150 deg.C) in total epoxy resin with (B) a phenol resin curing agent containing >=30 wt.% phenol resin of formula II [R is a halogen or a 1-12C alkyl; (1) is a positive integer of 1-10; (m) is 0 or positive integer of 1-3; (n) is 0 or a positive integer of 1-4] in total phenol resin, (C) 1,8-diazabicylo(5,4,0)undecene-7 and (D) fused silica powder (preferably spherical silica) contained in an amount of 80-90 wt.% based on total epoxy resin composition. Characteristics such as small warping at room temperature and in soldering process can be expected in a semiconductor device sealed by the above composition.
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Inventors:
SHIGENO KAZUYA
Application Number:
JP25301297A
Publication Date:
April 06, 1999
Filing Date:
September 18, 1997
Export Citation:
Assignee:
SUMITOMO BAKELITE CO
International Classes:
C08K3/36; C08G59/24; C08G59/62; C08L63/00; H01L23/29; H01L23/31; (IPC1-7): C08L63/00; C08G59/24; C08G59/62; C08K3/36; H01L23/29; H01L23/31
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