Title:
EPOXY RESIN COMPOSITION FOR SHEET MOLDING COMPOUND
Document Type and Number:
Japanese Patent JPH02235919
Kind Code:
A
Abstract:
PURPOSE:To obtain the title composition which can be easily converted into B stage and has a high curing rate by compounding specified epoxy resins, an aliphatic isocyanate having a heterocyclic ring, dicyandiamide and a cure accelerator each in a specified amount. CONSTITUTION:The title composition comprises 100pts.wt. liquid epoxy resin of an average hydroxyl functionality per molecule <= 0.5 (e.g. liquid bisphenol A glycidyl ether), 3 to 30pts.wt. solid epoxy resin having an average hydroxyl functionality per molecule of 2-15 and an average epoxy functionality >= 1.5 (e.g. solid bisphenol A glycidyl ether), 1 to 10pts.wt. aliphatic isocyanate having a heterocyclic ring (e.g. hexamethylene diisocyanate trimer), 3 to 15pts.wt. dicyandiamide, and 0.1 to 5pts.wt. cure accelerator (e.g. 2-undecylimidazole).
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Inventors:
TAKAHASHI TSUTOMU
HAYASHI MIKIO
HAYASHI MIKIO
Application Number:
JP5666389A
Publication Date:
September 18, 1990
Filing Date:
March 08, 1989
Export Citation:
Assignee:
SUMITOMO CHEMICAL CO
International Classes:
C08J5/24; C08G18/58; C08G59/00; C08G59/40; C08L63/00; (IPC1-7): C08G18/58; C08G59/40; C08J5/24; C08L63/00
Attorney, Agent or Firm:
Mitsuhiro Moroishi (1 person outside)
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