PURPOSE: To provide an epoxy resin compsn. which has excellent resistance to moisture and corrosion, etc. and is used for the sealing of electronic parts, by blending at least one member selected from phosphate, phosphate and polyphosphate esters with an epoxy resin contg. a hardener and an inorg. filler.
CONSTITUTION: A hardener such as a phenolic or an amine, 150W450pts.wt. inorg. filler such as crystalline silica or alumina, and 0.01W5pts.wt. at least one compd. selected from phosphate, phosphite and polyphosphate esters and as propyl phosphate, butyl phosphate and diphenyl trimetaphosphate, are mixed with 100pts.wt. epoxy resin such as a bisphenol A type epoxy resin or a phenolic novolak type epoxy resin to obtain the desired epoxy resin compsn.
KOBAYASHI MASAYUKI
ASAI SHINICHIROU
