To obtain an epoxy resin molding material which is excellent in reflow resistance, moisture resistance, etc., by incorporating an epoxy resin, a phenol compd. having phenol-derived and naphthol-derived structural units in the main chain, an adduct of a tert. phosphine and a quinone compd., and a specified amt. of an inorg. filler into the same.
This molding material contains an epoxy resin (e.g. a phenol novolak-type epoxy resin), a phenol compd. having phenol-derived structural units of formula I and 10-60 wt.% naphthol-derived structural units of formula II in the main chain as the curing agent in an equivalent ratio of the epoxy resin to the phenol compd. of 0.6-1.4, 0.005-2 wt.% cure accelerator (e.g. an adduct of n-butyldiphenylphosphine and p-benzoquinone), 60-80 vol.% inorg. filler (e.g. crystalline silica having an average particle size of 10-30 μm and contg. at least 70 wt.% spherical particles), 0.002-3 wt.% anion exchanger (e.g. hydrotalcite), and other necessary additives.
TO HARUAKI
AKAGI SEIICHI
