Title:
EPOXY RESIN MOLDING MATERIAL FOR SEALING SEMICONDUCTOR
Document Type and Number:
Japanese Patent JPS62243614
Kind Code:
A
Abstract:
PURPOSE: To obtain the titled material having excellent moisture-resistance and low internal stress and suitable for semiconductor sealing, by compounding a solid epoxy resin at a specific ratio to an epoxy resin component.
CONSTITUTION: The objective material can be produced by compounding a solid epoxy resin (e.g. bisphenol A epoxy resin) at an amount of 5W40wt% based on the epoxy resin component.
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Inventors:
MARUO KATSUHIKO
Application Number:
JP8937286A
Publication Date:
October 24, 1987
Filing Date:
April 17, 1986
Export Citation:
Assignee:
MATSUSHITA ELECTRIC WORKS LTD
International Classes:
C08G63/00; C08G59/00; C08G59/18; C08L63/00; (IPC1-7): C08G59/18; C08G63/00
Attorney, Agent or Firm:
Takehiko Matsumoto
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