To provide an epoxy-silicone mixed resin composition suitable as a light emitting semiconductor covering protective material having, as basic properties, transparency, no surface tackiness, and excellent transparency in the reflow test; and a light emitting semiconductor device covered by the same.
The epoxy-silicone mixed resin composition comprises, as essential ingredients, (A) an organopolysilsesquioxane resin having at least two epoxy functional groups or oxetanyl groups in one molecule, (B) an epoxy resin having at least two epoxy functional groups in one molecule, (C) a curing agent, and (D) a curing catalyst, characterized in that the curing catalyst contains at least one quaternary phosphonium salt. As for the epoxy-silicone mixed resin composition of the invention, a cured material thereof is used to protectively cover a light emitting semiconductor element to thereby inhibit discoloration in the reflow test, and accordingly, a light emitting semiconductor device excellent in mounting reliability can be provided, which gives enormous industrial merits. Further, a cured material having a glass transition point of 130C or higher is particularly utterly free of dust adhesion on the surface of the cured material and has excellent crack resistance in a heat resistance test.
KODAMA KINYA
SHIMIZU HISASHI
KASHIWAGI TSUTOMU
| JP2005089601A | 2005-04-07 | |||
| JP2007070554A | 2007-03-22 |
| WO2006083025A1 | 2006-08-10 |
Saori Shigematsu
Katsunari Kobayashi
Takeshi Ishikawa