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Title:
基板とパワーエレクトロニクス素子を備えた装置およびその製造方法
Document Type and Number:
Japanese Patent JP4763463
Kind Code:
B2
Abstract:
A layer of electrically insulating material is applied to a substrate and a component located thereon, in such a way that said layer follows the surface contours.

Inventors:
Norbert Zelliger
Karl Weitner
Jörg Tzapf
Application Number:
JP2005518649A
Publication Date:
August 31, 2011
Filing Date:
January 26, 2004
Export Citation:
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Assignee:
Siemens Aktiengesellschaft
International Classes:
H01L21/60; H01L23/538; H01L25/07
Domestic Patent References:
JPS50122877A1975-09-26
JPH0951020A1997-02-18
JP2003086762A2003-03-20
JPH04188642A1992-07-07
JP2005515616A2005-05-26
JP2002343927A2002-11-29
JPH1074891A1998-03-17
Attorney, Agent or Firm:
Toshio Yano
Takuya Kuno
Einzel Felix-Reinhard



 
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