Title:
EQUIPMENT AND METHOD FOR PEELING SUBSTRATE
Document Type and Number:
Japanese Patent JP3770740
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide substrate peeling equipment and a substrate peeling method which can peel excellently a substrate held by a substrate holding stand from it.
SOLUTION: This substrate peeling equipment peels a substrate 2 held by a substrate holding stand 3 in the state that residual attractive force due to charge is present from the stand 3, and is provided with a pushing-up part 23 which can advance and retreat from the stand 3 and pushes up the substrate 2, a driving motor 17 which generates a driving force to make the pushing-up part 23 advance and retreat, and magnetic couplings 9A, 9B which are arranged face to face and make a pair. The one magnetic coupling 9A is fixed to a moving member 25 which is moved by the driving motor 17, and the other magnetic coupling 9B is fixed to the pushing-up member 23 side. A driving force of the driving motor 17 is transferred to the pushing-up part 23 via the magnetic couplings 9A, 9B.
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Inventors:
Hideo Haraguchi
Ide Matsuda
Ide Matsuda
Application Number:
JP32869598A
Publication Date:
April 26, 2006
Filing Date:
November 19, 1998
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
H01L21/68; H01L21/683; C23C16/458; H01L29/786; (IPC1-7): H01L21/68; H01L29/786
Domestic Patent References:
| JP8236604A | ||||
| JP7321182A |
Attorney, Agent or Firm:
Yoshihiro Morimoto