Title:
インターリービング深度を調整するための装置及び方法
Document Type and Number:
Japanese Patent JP7080933
Kind Code:
B2
Abstract:
To provide a device and a method for adjusting (controlling) the interleaving depth when interleaving is performed in a digital communication system.SOLUTION: In an interleaving depth control method a modulo operation is performed on the interleaving depth and the total number of codewords. It is determined whether the result of the modulo operation excludes "0" on the basis of the result of comparing the total number of codewords with the interleaving depth. When the interleaving depth is greater than the total number of codewords, then interleaving is performed on an interleaving block at the adjusted interleaving depth, and the adjusted interleaving depth is the result of the modular operations performed.SELECTED DRAWING: Figure 2
Inventors:
Park, Chan Sung
Kim, Young Soo
Sim, Jeuk
Hong, Young Jun
Fan, Hyo Sung
Kim, Young Soo
Sim, Jeuk
Hong, Young Jun
Fan, Hyo Sung
Application Number:
JP2020124679A
Publication Date:
June 06, 2022
Filing Date:
July 21, 2020
Export Citation:
Assignee:
Samsung Electronics Company Limited
International Classes:
H03M13/27; H04L1/00
Foreign References:
| WO2012157284A1 | ||||
| US20020188905 |
Other References:
Kiran Bynam et al.,Samsung physical layer proposal,IEEE 802.15-13/0623r0,IEEE, インターネット,2013年10月31日
Kiran Bynam et al.,Samsung and IMEC physical layer merged proposal,IEEE 802.15-14/0178r0,IEEE, インターネット,2014年03月18日
Kiran Bynam et al.,Samsung and IMEC physical layer merged proposal,IEEE 802.15-14/0178r0,IEEE, インターネット
Attorney, Agent or Firm:
Kyosei International Patent Office