Title:
ESTIMATION METHOD OF ADHESION STRENGTH BETWEEN ADHEREND AND METAL AT METAL PLATING TIME
Document Type and Number:
Japanese Patent JP2005049191
Kind Code:
A
Abstract:
To provide a method for estimating simply and nondestructively adhesion strength between an adherend and a metal at the metal plating time.
In this estimation method of the adhesion strength between the adherend and the metal at the metal plating time, a functional group on the PC/ABS alloy surface is measured by an infrared spectroscopy, and the adhesion strength between the adherend and the metal at the metal plating time is estimated from the ratio between C=O bonds in the PC and C=C bonds in butadiene.
Inventors:
ITO TAKAO
Application Number:
JP2003280797A
Publication Date:
February 24, 2005
Filing Date:
July 28, 2003
Export Citation:
Assignee:
SUMITOMO METAL MINING CO
International Classes:
G01N21/3563; G01N21/35; (IPC1-7): G01N21/35
Attorney, Agent or Firm:
Masuaki Tanaka