To provide an etching liquid for micro-etching a copper surface which can securely maintain adhesion between a copper layer and an insulating layer even under high temperature conditions, and further can improve adhesion to wide insulating materials.

Disclosed is an etching liquid for copper comprising: sulfuric acid of 60 to 220 g/L; hydrogen peroxide of 5 to 70 g/L; and water, and comprising: phenyl tetrazoles of 0.01 to 0.7 g/L; and nitro benzotriazoles of 0.01 to 1.5 g/L, and further comprising: benzenesulfonic acids; and chloride ions.