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Title:
ETHYLENIC COPOLYMER MIXTURE
Document Type and Number:
Japanese Patent JPS63317543
Kind Code:
A
Abstract:

PURPOSE: To provide an ethylenic copolymer mixture composed of three specific kinds of ethylenic copolymers and capable of giving a crosslinked polymer having excellent heat-resistance, moldability, adhesivity to metals, etc., and electrical insulation property.

CONSTITUTION: The objective copolymer mixture is composed of (A) a copolymer composed of at least ethylene and 0.3W15mol.% of an α,β-unsaturated dicarboxylic acid anhydride and preferably containing a radically polymerizable monomer having polar group (preferably methyl methacrylate), (B) a copolymer of at least ethylene and 0.3W10mol.% of a radically copolymerizable unsaturated monomer having epoxy group (e.g. glycidyl acrylate) and (C) a saponified product of a copolymer of ethylene and 0.3W30mol.% of vinyl acetate (preferably having a saponification degree of ≥15%). The amount of the component A is 5W95wt.% based on the sum of A and B and the molar ratio of the acid anhydride group in the component A to the OH group in the component C is 1:0.05W1.5.


Inventors:
IWASHITA TOSHIYUKI
MOGI YOSHIHIRO
KUROSAWA HAYASHI
Application Number:
JP15338587A
Publication Date:
December 26, 1988
Filing Date:
June 22, 1987
Export Citation:
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Assignee:
SHOWA DENKO KK
International Classes:
C08L23/08; B32B27/28; B32B27/32; C08L23/00; C08L23/26; C08L29/04; (IPC1-7): C08L23/08; C08L23/26
Attorney, Agent or Firm:
Yaguchi flat



 
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