Title:
評価方法、マスクパターン補正方法、半導体装置の製造方法、及びプログラム
Document Type and Number:
Japanese Patent JP4481723
Kind Code:
B2
Abstract:
A method for evaluating a local flare in an exposure tool, includes: measuring a projection light intensity distribution by transferring a monitor mask pattern onto a semiconductor substrate; calculating a first ratio between an illumination light intensity on the monitor mask pattern and a first projection light intensity calculated based on the monitor mask pattern; calculating a distribution function of a local flare, due to a mask pattern coverage of the monitor mask pattern, based on the first ratio and the projection light intensity distribution; dividing a design mask pattern into a plurality of unit areas; calculating a second ratio between the illumination light intensity on each of the unit areas and a second projection light intensity calculated based on the design mask pattern; and calculating a local flare intensity in each of the unit areas, based on the second ratio and the distribution function.
Inventors:
Kazuya Fukuhara
Satoshi Tanaka
Kenji Chiba
Kei Hayasaki
Kenji Kawano
Satoshi Tanaka
Kenji Chiba
Kei Hayasaki
Kenji Kawano
Application Number:
JP2004154878A
Publication Date:
June 16, 2010
Filing Date:
May 25, 2004
Export Citation:
Assignee:
Toshiba Corporation
International Classes:
G03B27/72; G03F1/36; G03F1/84; H01L21/027
Domestic Patent References:
| JP2004062096A | ||||
| JP2004064024A | ||||
| JP2003100624A | ||||
| JP2001296646A |
Foreign References:
| WO2005008754A1 |
Attorney, Agent or Firm:
Hidekazu Miyoshi
Iwa Saki Kokuni
Kawamata Sumio
Nakamura Tomoyuki
Masakazu Ito
Shunichi Takahashi
Toshio Takamatsu
Iwa Saki Kokuni
Kawamata Sumio
Nakamura Tomoyuki
Masakazu Ito
Shunichi Takahashi
Toshio Takamatsu