Title:
ＦＰＩＣフィルム及びその製造方法
Document Type and Number:
Japanese Patent JP6938595
Kind Code:
B2
Abstract:
The present invention relates to a flexible photo imageable coverlay (FPIC) film comprising a photosensitive adhesive layer, and to a manufacturing method thereof and, more specifically, to a FPIC film with excellent developability and excellent hole plugging and bendability, and to a manufacturing method thereof.
Inventors:
Kim, Hyun Min
Yoo, Seung Ju
Kim, Song Gun
Kwon, John Min
Yoo, Seung Ju
Kim, Song Gun
Kwon, John Min
Application Number:
JP2019198920A
Publication Date:
September 22, 2021
Filing Date:
October 31, 2019
Export Citation:
Assignee:
INNOX Advanced Materials Co.,Ltd.
International Classes:
C09J7/30; C08G73/10; C09J133/00; C09J175/04; C09J179/08; G03F7/004; G03F7/037; H05K1/03
Domestic Patent References:
| JP2010084121A | ||||
| JP2015018049A | ||||
| JP2002003715A |
Foreign References:
| WO2011059089A1 | ||||
| WO2008149625A1 |
Attorney, Agent or Firm:
Axis International Patent Business Corporation