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Title:
FABRICATION OF INFRARED DETECTION ELEMENT
Document Type and Number:
Japanese Patent JP2595898
Kind Code:
B2
Abstract:

PURPOSE: To obtain a clear infrared image having no defective pixel by eliminating insufficient connection between an infrared detecting section and an integrated circuit for reading out signal in the fabrication of a loop hole type infrared detection element.
CONSTITUTION: When an adhesive layer 2 is removed from the bottom of a large number of through holes 4 made in array at an infrared receiving section 1 employing a p-type HgCdTe, a plating film 7a is formed on the electrode pad 6 of a circuit for reading out signal in order to decide presence of a residual adhesive layer 2. Furthermore, a contact electrode 7b is formed by plating between the infrared detecting section 1 and the electrode pad 6. A more uniform contact electrode 7 can be formed by short-circuiting the infrared detecting section 1 and a counter electrode 12 when the presence of residual adhesive layer is determined whereas short-circuiting a Pt sputter film 14 and the counter electrode 12 when a contact electrode 7b is formed.


Inventors:
Masahiko Sano
Application Number:
JP12341994A
Publication Date:
April 02, 1997
Filing Date:
June 06, 1994
Export Citation:
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Assignee:
NEC
International Classes:
G01J1/02; C25D7/12; H01L21/28; H01L21/302; H01L21/3065; H01L21/822; H01L27/04; H01L27/14; H01L31/0264; H01L31/10; (IPC1-7): H01L31/10; G01J1/02; H01L21/28; H01L21/3065; H01L21/822; H01L27/04; H01L27/14
Domestic Patent References:
JP6433931A
JP4335580A
JP5218377A
JP5283665A
JP6209096A
JP6326342A
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)