Title:
FABRICATION OF INTEGRATED MICROWAVE ASSEMBLY
Document Type and Number:
Japanese Patent JP3238685
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To interconnect electric parts on an integrated microwave assembly requiring no lamination accurately while isolating electrically by removing the select pattern of a second conductive layer covering a first conductive layer for forming vias and an isolation wall and forming a signal line.
SOLUTION: In order to form an isolation wall, a photoresist layer is applied to cover a conductive substrate having an appropriate thickness. Photoresist is then removed selectively to expose a part of the conductive substrate. A first conductive layer 24 serving as an isolation wall is then applied to cover the exposed part. Subsequently, a second specified part of photoresist is removed to form a cavity for arranging an electric part 28. Thereafter, the electric part 28 is covered with a first conductive layer 30 along with the remaining exposed part and a second conductive layer is applied to cover an electric contact 34 and the first conductive layer 30. Finally, a preselected part of the second conductive layer is removed and the second conductive layer is patterned to form a first signal line 40.
Inventors:
Alfred E Lee
Roger A. David Heiser
James Sea Lau
Roger A. David Heiser
James Sea Lau
Application Number:
JP22820299A
Publication Date:
December 17, 2001
Filing Date:
August 12, 1999
Export Citation:
Assignee:
TRW INCORPORATED
International Classes:
H05K3/46; H01L21/50; H01L23/552; H01L23/66; H01L25/00; H01L25/04; H01L25/18; H01P11/00; H05K1/02; H05K1/18; H05K3/00; (IPC1-7): H01L25/04; H01L25/00; H01L25/18; H01P11/00; H05K3/46
Domestic Patent References:
| JP7176453A |
Attorney, Agent or Firm:
Kazuo Shamoto (5 outside)
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