Title:
FACE-DOWN BONDER
Document Type and Number:
Japanese Patent JPS59208844
Kind Code:
A
Abstract:
PURPOSE:To use even materials except solder as bump materials by bonding a semiconductor element with a substrate while being given an ultrasonic vibration. CONSTITUTION:A face-down bonded semiconductor element 6 is sucked into the opening section 5 of the lower surface of a vacuum suction nozzle 4 under vacuum, and positioned so that bump materials 7 for the semiconductor element 6 are positioned at the position of bonding of a substrate 9. When an ultrasonic vibration from a vibrator 1 is transmitted over the semiconductor element 6 through a horn 2 and the vacuum suction nozzle 4 under the state, the bump materials 7 for said semiconductor element 6 are bonded at the predetermined position of bonding by the ultrasonic vibration action. Accordingly, the semiconductor element 6 is face-down bonded on the substrate 9 through the bump materials 7. Materials, such as aluminum, gold, copper, etc. are also used besides solder as a material for the bump materials.
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Inventors:
OKUYA KEN
Application Number:
JP8265283A
Publication Date:
November 27, 1984
Filing Date:
May 13, 1983
Export Citation:
Assignee:
HITACHI LTD
International Classes:
H01L21/52; H01L21/60; H01L21/607; (IPC1-7): H01L21/58
Attorney, Agent or Firm:
Akio Takahashi