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Title:
ファイバー及びこれを用いた発光素子並びにその製造方法
Document Type and Number:
Japanese Patent JP7157324
Kind Code:
B2
Abstract:
To provide a light emitting element using a substrate which is not a plate shape but an elongated fiber shape.SOLUTION: A light emitting element 100 includes: a fiber 10 made of sapphire or spinel; and a semiconductor light emitting structure 20 formed on an outer peripheral surface of the fiber 10. The fiber 10 includes a core body 12 made of metal extended along an extension direction of the fiber 10 inside made of sapphire or spinel. By providing the metal core body 12 inside a fiber substrate, the core body 12 is used to facilitate heating during manufacturing. Further, for heat dissipation when the obtained light emitting element 100 emits light, stable operation becomes possible by using the metal core body 12.SELECTED DRAWING: Figure 2

Inventors:
Mitsutomo Okamura
Satoshi Inohara
Application Number:
JP2018186192A
Publication Date:
October 20, 2022
Filing Date:
September 29, 2018
Export Citation:
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Assignee:
Nichia Corporation
International Classes:
H01L33/24
Domestic Patent References:
JP2008141005A
JP2001338886A
Foreign References:
EP1571475A1
Attorney, Agent or Firm:
Koji Toyosu
Toyosu Yasuhiro



 
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