Title:
電子部品を含む熱溶解積層法のためのフィラメント
Document Type and Number:
Japanese Patent JP6560835
Kind Code:
B2
Abstract:
A method for manufacturing a 3D item (10) comprising an electronic component (40), wherein the method comprises the step of printing with a fused deposition modeling (FDM) 3D printer (500) 3D printable material (201) to provide said 3D item (10), wherein the 3D printable material (201) comprises said electronic component (40). The fused deposition modeling (FDM) 3D printer comprises a printer nozzle, and the method further comprises the steps of providing upstream of the printer nozzle a filament of 3D printable material, wherein the filament comprises a cavity for hosting the electronic component, and creating upstream of the printer nozzle an assembly of the filament and the electronic component.
Inventors:
Hikumet Rifato Attamstafa
Van Bommel Thais
Van Bommel Thais
Application Number:
JP2018563151A
Publication Date:
August 14, 2019
Filing Date:
May 30, 2017
Export Citation:
Assignee:
SIGNIFY HOLDING B.V.
International Classes:
B29C64/321; B29C64/118; B29C64/209; B33Y10/00; B33Y30/00
Foreign References:
| WO2015136982A1 | ||||
| US20090173443 | ||||
| US20090177309 | ||||
| WO2015077262A1 |
Attorney, Agent or Firm:
Sakiko Shibata