Title:
充填剤入りポリイミドおよびそれに関係する方法
Document Type and Number:
Japanese Patent JP2013507486
Kind Code:
A
Abstract:
The present disclosure relates generally to filled polyimides that can be formed into films, fibers and other articles. The filled polyimide is useful in coverlay applications and has advantageous dielectric, mechanical and optical properties.
Inventors:
Sarah bowsard
Application Number:
JP2012533271A
Publication Date:
March 04, 2013
Filing Date:
October 06, 2010
Export Citation:
Assignee:
E.I.DU PONT DE NEMOURS AND COMPANY
International Classes:
C08L79/08; C08G73/10; C08L33/20; C09J7/02; C09J161/20; C09J163/00; C09J179/08; C09J201/00; D01F6/74; D01F6/94
Attorney, Agent or Firm:
Patent Business Corporation Tani/Abe Patent Office