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Patent Searching and Data


Title:
FILLER FOR POLYMER
Document Type and Number:
Japanese Patent JPS63317540
Kind Code:
A
Abstract:

PURPOSE: To provide a filler for polymer giving a polymer composition having excellent moldability, thermal shock resistance and remarkably suppressed burr generation, by using fine powder satisfying a specific condition and preferably coarse powder as the components.

CONSTITUTION: The objective filler is composed of (A) 1W100wt.% of fine powder and (B) 0W99wt.% of coarse powder having larger average particle diameter than the powder A. Each of the components A and B has a maximum particle diameter of ≤500μm, especially ≤74μm. At least a part of the components A and B is spherical powder (preferably fused silica, semi-fused silica or silica-titania glass) and the particle size distribution of the component A satisfies the formula IWformula III [X is content (wt.%) of particles of 0.1W1μm in diameter; y is content (wt.%) of particles of 0.1W2μm in diameter; z is content (wt.%) of particles of 0.1W3μm in diameter]. The content of the filler in a resin composition is 20W97wt.%.


Inventors:
CHIBA TAKASHI
TAKAHASHI KAZUO
OTAGURO KENJI
Application Number:
JP15203887A
Publication Date:
December 26, 1988
Filing Date:
June 18, 1987
Export Citation:
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Assignee:
DENKI KAGAKU KOGYO KK
International Classes:
C04B20/00; C08K7/00; H01B3/30; (IPC1-7): C04B20/00; C08K7/00; H01B3/30