Title:
Film formation method
Document Type and Number:
Japanese Patent JP6329589
Kind Code:
B2
Abstract:
A film formation method comprises a catalyst film formation step of forming a catalyst film on a surface of a substrate by substitution reduction plating, an intermediate film formation step of forming a palladium plating film on the catalyst film, and a surface film formation step of forming a gold plating film on the palladium plating film.
More Like This:
| JPH02153077 | METHOD FOR PLATING ELECTRIC INSULATOR |
| JP4129629 | Electroless gold plating bath |
Inventors:
Katsuhisa Tanabe
Someya Ritsushi
Naoshi Nishimura
Tetsuya Sasamura
Eriko Furuya
Someya Ritsushi
Naoshi Nishimura
Tetsuya Sasamura
Eriko Furuya
Application Number:
JP2016116993A
Publication Date:
May 23, 2018
Filing Date:
June 13, 2016
Export Citation:
Assignee:
Uemura Industry Co., Ltd.
International Classes:
C23C18/44
Domestic Patent References:
| JP2013108180A | ||||
| JP2004137589A | ||||
| JP2008144188A | ||||
| JP2001107259A | ||||
| JP2008184679A | ||||
| JP9008438A | ||||
| JP5327187A | ||||
| JP2007123883A | ||||
| JP2005054267A | ||||
| JP2012052156A |
Foreign References:
| WO2004111287A2 |
Attorney, Agent or Firm:
Maeda patent office