Title:
成膜方法及び成膜用基板の作製方法
Document Type and Number:
Japanese Patent JP5666556
Kind Code:
B2
Abstract:
One embodiment of the present invention is a film forming method including the steps of forming an absorption layer 12 over one surface of a first substrate 11; forming a layer 16 containing a high molecular compound over the absorption layer; removing an impurity in the layer containing the high molecular compound by performing a first heat treatment on the layer 16; forming a material layer 18 containing a first film formation material and a second film formation material over the layer 16; performing a second heat treatment to form a mixed layer 19 in which the material layer and the layer 16 are mixed over the absorption layer; and performing third heat treatment to form a layer 19a containing the first film formation material and the second film formation material on a film-formation target surface of a second substrate.
Inventors:
青山 智哉
池田 寿雄
井上 智
園田 通
池田 寿雄
井上 智
園田 通
Application Number:
JP2012505595A
Publication Date:
February 12, 2015
Filing Date:
February 28, 2011
Export Citation:
Assignee:
株式会社半導体エネルギー研究所
シャープ株式会社
シャープ株式会社
International Classes:
H05B33/10; H01L51/50
Domestic Patent References:
| JP2003229259A | 2003-08-15 | |||
| JP2008235010A | 2008-10-02 | |||
| JP2008291352A | 2008-12-04 | |||
| JP2009069849A | 2009-04-02 | |||
| JP2004039630A | 2004-02-05 | |||
| JP2006086069A | 2006-03-30 |
Foreign References:
| WO2007044518A1 | 2007-04-19 |
Attorney, Agent or Firm:
Mutsuyasu Yanase
Atsushi Watabe
Atsushi Watabe