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Title:
FILM THICKNESS CONTROL METHOD FOR GOLD PLATING
Document Type and Number:
Japanese Patent JPH11325838
Kind Code:
A
Abstract:

To provide a film thickness control method for gold plating which makes it possible to judge existence of an extremely thin gold-flash-plated film of 0.01 μm or less easily and in a short time, and to make sure of the realization of a mass production line.

Existence of an extremely thin gold-flash-plated film is judged using a color difference meter or spectrophotometer. In a plating apparatus for plating the surface of a lead frame, as a concrete favorable method, the part of the lead frame is masked with a tape before performing gold plating, the lead frame gold-flash-plated is washed after that by water and dried. After that, the masking tape is stripped. The gold-flash-plated part and the masking tape stripped part are measured using the spectrophotometer or color difference meter, and existence of a gold-flash-plated film is judged. It is desirable that the wavelength of the light source of the sperophotometer should be 200-400 nm. It is preferable that the wavelength of the light source of the color difference meter should be 400-700 nm.


Inventors:
AKINO HISANORI
CHINDA SATOSHI
TOMOBE MASAKATSU
Application Number:
JP12579698A
Publication Date:
November 26, 1999
Filing Date:
May 08, 1998
Export Citation:
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Assignee:
HITACHI CABLE
International Classes:
G01B11/06; G01J3/46; G01N21/88; G01N21/956; G01N33/20; (IPC1-7): G01B11/06; G01J3/46; G01N21/88; G01N33/20
Attorney, Agent or Firm:
Takashi Matsumoto