Title:
指紋検出装置及びその製造方法
Document Type and Number:
Japanese Patent JP4765226
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To reduce stresses applied to a protective film and to prevent stress migration, etc., of a wiring material in a semiconductor chip compared with conventional examples. SOLUTION: A fingerprint detection device is provided with a fingerprint sensor chip 10 and a carbon-based protective film 14 provided on the outermost surface of the chip 10. A diamond-like carbon is used for the protective film 14, and this carbon is formed at a film forming temperature of 200-450 deg.C. By this configuration, the stress applied to the carbon can be reduced compared with a protective film formed at not more than 200 deg.C. Also, since the upper limit of the film forming temperature is set at 450 deg.C, breakage of an aluminum wiring material, etc., due to the stress migration in the chip 10 can be suppressed, and peeling off of the film itself can be prevented.
Inventors:
Shuichi Oka
Seiichi Miyai
Seiichi Miyai
Application Number:
JP2001249294A
Publication Date:
September 07, 2011
Filing Date:
August 20, 2001
Export Citation:
Assignee:
ソニー株式会社
International Classes:
A61B5/117; C23C16/27; G01B7/00; G06T1/00
Domestic Patent References:
| JP5202477A | ||||
| JP11072306A | ||||
| JP2001148112A | ||||
| JP4231803A |
Foreign References:
| WO1999045496A1 | ||||
| WO2001036905A1 |
Attorney, Agent or Firm:
Takahisa Sato