Title:
FIXING METHOD FOR LEAD WIRE
Document Type and Number:
Japanese Patent JPS5688330
Kind Code:
A
Abstract:
PURPOSE:To automate the nail head bonding of gold wire by providing a silver plated layer having specified roughness of the surface on a metal conducting wire on an insulating substrate. CONSTITUTION:A copper foil 3 is bonded to the insulating layer 2 of the substrate 10 having the thin insulating layer 2 on Al 1, and a silver plated layer 4 is selectively formed. The copper foil 3 is etched out with the silver layer 4 as a mask, and the conducting path is formed. In this case, if the roughness of the surface of the silver plating 4 is about 1.5-5mu, the anchor effect is yielded when the lead wire 6 is fixed, the fixed cross sectional area is increased, and the lead wire can be fixed to the uncontaminated surface whose tip of the convex portion is not deformed. Therefore, the excellent nail head bonding is realized only by the selection of the roughness of the surface of the silver plated layer, and the automation by the nail head bonding without directivity becomes possible.
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Inventors:
ABE TADAO
KAZAMI AKIRA
KAZAMI AKIRA
Application Number:
JP16617379A
Publication Date:
July 17, 1981
Filing Date:
December 19, 1979
Export Citation:
Assignee:
SANYO ELECTRIC CO
TOKYO SANYO ELECTRIC CO
TOKYO SANYO ELECTRIC CO
International Classes:
H01L21/603; H01L21/60; (IPC1-7): H01L21/60