To provide an adhesive for various printed-wiring boards which is halogen-free, has excellent flame retardance and excellent adhesion due to the stress relaxation action, a flame-retardant and heat-resistant resin composition useful for adherent films, an adherent film, and a polyimide film with an adhesive.

The flame-retardant and heat-resistant resin composition comprises (A) a modified polyamideimide resin having a microphase separated structure composed of a siloxane unit and an alicyclic unit as the soft segments and an aromatic unit as the hard segment, (B) a thermosetting resin, and (C) an organic phosphorus compound. The adherent film has an adhesive layer formed from this flame-retardant and heat-resistant resin composition, and the polyimide film with an adhesive has this adhesive layer formed on a polyimide film.

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