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Title:
FLAME-RETARDANT RESIN COMPOSITION AND MOLDED PRODUCT HAVING ELECTROCONDUCTIVITY
Document Type and Number:
Japanese Patent JP2002371178
Kind Code:
A
Abstract:

To provide an electroconductive resin composition suitable as a molding material for electronic devices, having excellent flame retardance, heat resistance, impact resistance, fluidity and rigidity to enable producing a thin-wall molded product and an excellent electromagnetic wave shielding activity and recyclable of the resin and a molded product using the same.

This flame-retardant resin composition having electroconductivity is obtained by compounding 100 pts.wt. of a resin component with 10-40 pts.wt. of a phosphorus flame retardant, 0-5 pts.wt. of a fluorine resin, 5-40 pts.wt. of carbon fibers and 5-40 pts.wt. of stainless steel fibers. The resin component comprises (A) 50-90 wt.% of a polycarbonate resin, (B) 10-50 wt.% of a graft copolymer prepared by graft polymerization of an aromatic vinylmonomer, a vinylcyanide monomer and other monomers which are used if necessary and copolymerizable therewith in the presence of a rubber-like polymer and (C) 0-50 wt.% of a vinylic copolymer obtained by copolymerizing the aromatic vinylmonomer with the vinylcyanide monomer and other monomers which are used as necessary and copolymerizable therewith.


Inventors:
KAMICHIKA MASASHI
FUJIMOTO IWAO
TANIGAWA HIROSHI
HIROMOTO YASUYUKI
YOSHITOMI TSUTOMU
Application Number:
JP2001180354A
Publication Date:
December 26, 2002
Filing Date:
June 14, 2001
Export Citation:
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Assignee:
UBE CYCON LTD
International Classes:
C08J5/00; C08K5/521; C08K7/04; C08K7/06; C08L69/00; H01B1/00; H01B1/22; H01B1/24; H05K9/00; (IPC1-7): C08L69/00; C08J5/00; C08K5/521; C08K7/04; C08K7/06; H01B1/00; H01B1/22; H01B1/24; H05K9/00
Domestic Patent References:
JP2000103954A2000-04-11
JPS6390564A1988-04-21
JPH06240128A1994-08-30
JP2002105303A2002-04-10
Attorney, Agent or Firm:
Tsuyoshi Shigeno