FLEXIBLE DEVICE AND DISPLAY DEVICE, AND MANUFACTURING METHOD FOR THOSE DEVICES

Japanese Patent JP2017188652

A

PROBLEM TO BE SOLVED: To manufacture a flexible device at low temperatures and provide a manufacturing method for a flexible device with high mass-productivity.SOLUTION: On a first substrate, a second substrate is attached with a first adhesive layer, on the second substrate, a first insulating layer, a transistor, and a second insulating layer are formed, and the first substrate and the second substrate are separated while heat is applied at a first temperature. The second substrate is a flexible substrate. The heat-resisting temperature of the first substrate is a second temperature, and the heat-resisting temperature of the second substrate is a third temperature. The first adhesive layer contains a thermoplastic material whose heat-resisting temperature is a fourth temperature. Each of the first insulating layer, the second insulating layer, and the transistor is formed at a temperature of room temperature or higher and lower than the fourth temperature. The third temperature is higher than the fourth temperature and lower than the second temperature. The first temperature is higher than the fourth temperature and lower than the third temperature.SELECTED DRAWING: Figure 4

YAMAZAKI SHUNPEI
ADACHI HIROKI
IDOJIRI SATORU
YOSHIZUMI KENSUKE

JP2016250847A

October 12, 2017

December 26, 2016

Click for automatic bibliography generation  

SEMICONDUCTOR ENERGY LAB CO LTD

H01L21/336; G02F1/1368; G09F9/00; H01L29/786; H01L51/50; H05B33/02; H05B33/04; H05B33/10

JP2014175463A	2014-09-22
JP2015187701A	2015-10-29
JP2013038229A	2013-02-21
JP2009076877A	2009-04-09
JP2013247233A	2013-12-09
JP2010258037A	2010-11-11
JP2010050152A	2010-03-04
JP2009167087A	2009-07-30

Previous Patent: Luminescent device

Next Patent: Luminescent device