Title:
FLEXIBLE ELECTRICALLY CONDUCTIVE PASTES AND DEVICES MADE THEREWITH
Document Type and Number:
Japanese Patent JP2023155272
Kind Code:
A
Abstract:
To meet a continuing need for improved stretchable electrical conductors and flexible electrically conductive adhesives (ECAs).SOLUTION: This invention provides a polymer thick film electrically conductive paste composition comprising: conductive metal powder; a resin blend of polyol and phenoxy resin; blocked aliphatic polyisocyanate; and one or more polar, aprotic solvents. In one embodiment, the paste composition is used to form an electrically conductive adhesive. In another embodiment, the paste composition is used to form an electrically conductive polymer thick film.SELECTED DRAWING: Figure 2
Inventors:
LEE HEE HYUN
EDMUND FRANCIS SCHIEFFER JR
HOANG VI TRAN
EDMUND FRANCIS SCHIEFFER JR
HOANG VI TRAN
Application Number:
JP2023130006A
Publication Date:
October 20, 2023
Filing Date:
August 09, 2023
Export Citation:
Assignee:
DUPONT ELECTRONICS INC
International Classes:
H05K3/00; C09J9/02; H05K3/32
Attorney, Agent or Firm:
Patent Attorney Tani / Abe Patent Office
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