Title:
FLEXIBLE PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP2008166555
Kind Code:
A
Abstract:
To provide a flexible printed wiring board in which minute wiring can be formed and which has proper running performance (easy slidability) and will not deform, even if lead-free solder is used.
The flexible printed wiring board contains a polyimide film, principally comprising 3,4'-diaminophenylether and 4,4'-diaminodiphenylether as a diamine component and a pyromellitic acid dihydride as an acid dihydride component, and further containing minute inorganic particles, wherein wiring is formed on one surface or on both surfaces of the polyimide film, with or without an adhesive.
Inventors:
KOKUNI MASAHIRO
SAWAZAKI KOICHI
MAEDA SHU
SAWAZAKI KOICHI
MAEDA SHU
Application Number:
JP2006355334A
Publication Date:
July 17, 2008
Filing Date:
December 28, 2006
Export Citation:
Assignee:
TORAY DU PONT KK
International Classes:
H05K1/03; C08J5/18; C08K3/00; C08L79/08
Attorney, Agent or Firm:
Tomonori Iwami
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