Title:
フレキシブル配線回路基板、その製造方法、および、撮像装置
Document Type and Number:
Japanese Patent JP7173752
Kind Code:
B2
Abstract:
A flexible wiring circuit board is provided with a first insulating layer, first wiring arranged on one side of the first insulating layer in the thickness direction, an adhesive layer arranged on oneside of the first wiring in the thickness direction, and a second insulating layer arranged on one side of the adhesive layer in the thickness direction, wherein the adhesive layer contains a reinforcing fiber layer having insulating properties.
Inventors:
Shusaku Shibata
Yoshihiro Kawabe
Hayato Takakura
Shuichi Wakaki
Yoshihiro Kawabe
Hayato Takakura
Shuichi Wakaki
Application Number:
JP2018083305A
Publication Date:
November 16, 2022
Filing Date:
April 24, 2018
Export Citation:
Assignee:
NITTO DENKO CORPORATION
International Classes:
H05K1/02; H01L27/146; H04N5/225; H05K9/00
Domestic Patent References:
| JP7224269A | ||||
| JP200495566A | ||||
| JP2016122687A | ||||
| JP2005210628A |
Foreign References:
| WO2013183632A1 |
Attorney, Agent or Firm:
Hiroyuki Okamoto
Shinichi Uda
Shinichi Uda
Previous Patent: Memory module, memory system and method of operation
Next Patent: Inspection method and inspection device for twisted package
Next Patent: Inspection method and inspection device for twisted package