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Title:
FLEXIBLE WIRING BOARD AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JP2648544
Kind Code:
B2
Abstract:

PURPOSE: To obtain a FPC which can prevent floating from the mounting surface and pasted together with the mounting surface in a close adhesion state.
CONSTITUTION: A conductor circuit having a prescribed pattern is formed on a thin film insulating board 14 while solidifying an FPC (flexible wiring board) 25 to be pasted together with the mounting surface 3 of a meter main body 7 to the final mounting form.


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Inventors:
OZAKI KEIICHI
KUBOTA KATSUHIRO
Application Number:
JP20896192A
Publication Date:
September 03, 1997
Filing Date:
August 05, 1992
Export Citation:
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Assignee:
YAZAKI SOGYO KK
International Classes:
H01L23/12; H01L23/14; H05K1/02; H05K7/06; H05K7/14; H05K1/00; (IPC1-7): H05K1/02
Attorney, Agent or Firm:
Hidekazu Miyoshi (1 outside)



 
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