Title:
FLIP CHIP MOUNTING BODY AND METHOD FOR UNDER-FILLING IT
Document Type and Number:
Japanese Patent JP3243449
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an under-filling method by which the space between the IC chip and substrate of a flip flop mounting body can be filled with a resin solution for sealing even when the substrate has no through hole for air vent.
SOLUTION: A resin solution 11 for sealing is applied to the peripheral area of a flip chip mounting body 1 on the upper surface of a substrate 3 by the stencil printing, etc., in a vacuum atmosphere. Then, the space 12 formed between an IC chip 2 and the substrate 3 is filled up with the resin solution 11 by lowering the degree of vacuum of the vacuum atmosphere or returning the vacuum atmosphere to a normal atmospheric atmosphere. In other words, the space 12 is filled up with the solution 11 by utilizing a differential pressure. When the space 12 is filled up with the solution 11, the air remaining in the space 12 is pushed out and confined in a non-through hole 13 made into the substrate 3.
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Inventors:
Kenji Kanbara
Kazuo Ando
Kazuo Ando
Application Number:
JP11603898A
Publication Date:
January 07, 2002
Filing Date:
April 09, 1998
Export Citation:
Assignee:
Toray Engineering Co., Ltd.
International Classes:
H01L23/28; H01L21/56; H01L21/60; (IPC1-7): H01L23/28; H01L21/56; H01L21/60
Domestic Patent References:
| JP1050878A | ||||
| JP8153752A | ||||
| JP63241955A |
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