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Title:
フリップチップ実装装置及び実装方法
Document Type and Number:
Japanese Patent JP4501093
Kind Code:
B2
Inventors:
Yoshinao Kitano
Application Number:
JP2000213096A
Publication Date:
July 14, 2010
Filing Date:
July 13, 2000
Export Citation:
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Assignee:
NEC
International Classes:
H01L21/60; H01L21/52
Domestic Patent References:
JP8203966A
JP7221138A
JP11288980A
JP2000133684A
JP5074838A
JP10340931A
Attorney, Agent or Firm:
Keiji Miyamoto



 
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