Title:
FLIP-CHIP MOUNTING METHOD
Document Type and Number:
Japanese Patent JP2001015552
Kind Code:
A
Abstract:
To easily implement constant height control for IC chips.
An IC chip 3 is provided with an electrically connecting member 5 on an electrode pad 4, and a height regulating member 6. The member 5 provided on the chip 3 is mounted in position on an electrode pad 2 provided on a substrate 1. While controlling the height of the chip 3 with the member 6, the member 5 is jointed by heating to connect the pad 4 of the chip 3 to the pad 2 on the substrate 1.
Inventors:
HONDA MIKIO
Application Number:
JP18893999A
Publication Date:
January 19, 2001
Filing Date:
July 02, 1999
Export Citation:
Assignee:
SHINKAWA KK
International Classes:
H01L21/60; (IPC1-7): H01L21/60
Attorney, Agent or Firm:
Yoshinori Tanabe
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