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Patent Searching and Data


Title:
FLOOR HEATING PANEL AND ITS PLACING METHOD
Document Type and Number:
Japanese Patent JPH07293911
Kind Code:
A
Abstract:

PURPOSE: To reduce a troublesome handling in an installing work for a floor heating panel and eliminate an expenditure of work by a method wherein some small footings against which nails can be struck are carried by the floor heating panel.

CONSTITUTION: This floor heating panel is constructed such that there is provided a heat-insulating member 1 having a line heater 2 installed on its upper surface and a metallic plate 4 having the same thickness as that of the heat- insulating material arranged at one side of the heat-insulating member 1 is adhered on an upper entire surface of a small footing 3 having a width of about 30 to 50mm. A floor heating panel 5 constructed to have either small holes or recesses at an upper part of the small footing 3 of the metallic plate 4 is placed in sequence on a flat ground floor in its requisite number. After the small footing 3 is fixed to the ground floor with some nails or wooden screws or the like, a floor finishing material is fixed to the small footing 3 with adhesive agent or nails or wooden nails and the like.


Inventors:
HORIKAWA TOSHIHIRO
OKADA MAKOTO
Application Number:
JP8453094A
Publication Date:
November 10, 1995
Filing Date:
April 22, 1994
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
E04F15/18; F24D13/02; (IPC1-7): F24D13/02; E04F15/18
Attorney, Agent or Firm:
Akira Kobiji (2 outside)