To provide a floor panel for heating having excellent thermal insulation performance and excellent sound insulation performance and capable of dispensing with an underfloor thermal insulation material under a floor backing material.

This floor panel for heating A1 is composed of substantially rectangular platelike bodies 1 and forms a floor face for heating by connecting and collecting a plurality of them. A recessed part 3 is formed on a rear surface 2 of the platelike body 1, a planar heater 5a is laid on a bottom face 4 of the recessed part 3, and a vacuum thermal insulation material 6 is buried in the recessed part 3. Consequently, radiation of heat passing through the floor backing material 8 is effectively suppressed, sufficient thermal insulation performance can be ensured even if the underfloor thermal insulation material is not provided below the floor backing material 8, and sound insulation performance is improved.