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Patent Searching and Data


Title:
流体吐出装置および流体吐出方法
Document Type and Number:
Japanese Patent JP6687874
Kind Code:
B2
Abstract:
In conventional fluid discharge devices, a discharge head used should be increased in size according to increase in size of a workpiece such as silicon wafer. However, if the discharge head increases in length, a deformation amount of a mask used for discharging the fluid on the workpiece increases, thereby the discharging amount varies. Discharging the fluid in a reciprocating manner is performed using a fluid discharging device including a head unit having a width shorter than a length of the workpiece. A suction port having opening portions each having a slit shape are disposed on the both sides of the discharge nozzle in a vicinity of the discharge nozzle.

Inventors:
Hideki Nakamura
Takashi Nanai
Toshihiko Rotsuji
Ryoichi Suzuki
Application Number:
JP2019097444A
Publication Date:
April 28, 2020
Filing Date:
May 24, 2019
Export Citation:
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Assignee:
Senju Metal Industry Co., Ltd.
International Classes:
B05D1/26; B05C5/02; B05C11/10; B05C21/00; B05D3/12; B05D7/00; B05D7/24; B23K3/00; B23K3/06
Domestic Patent References:
JP2014157863A
JP7202399A
JP2005183542A
JP2004305791A
JP2005246139A
JP2014091222A
JP2004337704A
JP2002260985A
JP2017109211A
Foreign References:
WO2016114275A1
WO2017104746A1
Attorney, Agent or Firm:
Shinjiro Ono
Osamu Yamamoto
Toru Miyamae
Motoharu Nakanishi