To increase processing accuracy of fine holes by improving low processing accuracy of a conventional method of fluid polishing.
In a primary processing step of the fluid polishing method in which a slurry (7) is supplied by supply devices (2a, 2b) to polish a fine hole on a workpiece (5), the supply devices are stopped before a predetermined fine hole is processed, and a first operating fluid flow rate (Q1) at this time is measured. In a secondary processing step, a second processing time (T1) which does not arrive at the target processing is calculated based on Q1, the supply devices are stopped after the polishing is executed for the time of T1, and a second operating fluid flow rate (Q2) at this time is measured. In a finish processing step, a target third processing time (T2) is calculated based on Q2, and the polishing is executed for the time of T2. The processing time in the secondary and the finishing steps is determined by the processing ability coefficient which is the function of the ratio of the increasing amount of the operating fluid flow rate during processing to the processing time.
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| JP2004284014A | 2004-10-14 |
Jun Tsuruta
Tetsuro Shimada
Shinozaki Masami
Masaya Nishiyama