To improve working accuracy of a microhole by avoiding the occurrence of cylinder switching in the process of fluid polishing, and by preventing separation of slurry and deposition of abrasive grains in the cylinder.
In the fluid polishing method for machining a microhole by slurry 7, in the slurry flow target machining process, when slurry is supplied from the cylinder 2a until it is increased to an target value of a predetermined slurry supply flow rate to reach the target value, the cylinder is stopped and it is switched to another cylinder 2b. After that, the working fluid flow rate of the microhole is measured. In the next metering machining process to be performed, the required machining time is calculated, based upon the working fluid flow rate, and polishing is performed by another cylinder 2b for the required machining time. The cylinder is stopped and switched to measure the working fluid flow rate. The metering machining process is repeated until the working fluid flow rate reaches a predetermined value.
KATO SHINICHI
KIMURA KAZUNARI
Jun Tsuruta
Tetsuro Shimada
Shinozaki Masami
Masaya Nishiyama