FLUID POLISHING METHOD

Title:

FLUID POLISHING METHOD

Document Type and Number:

Japanese Patent JP2005177916

Kind Code:

A

Abstract:

To provide a fluid polishing method for preventing partial concentration of polishing on a hole inner surface to cause undercutting even when the hole of a workpiece is formed in a direction changing the flow of slurry flowing inside.

This fluid polishing method comprises a setting step for connecting the workpiece 10 to a slurry supply port 31; a pre-polishing step for supplying slurry to pass through the hole 10a of the workpiece while gradually increasing slurry supply pressure to a predetermined low pressure; and a post-polishing step for changing the slurry supply pressure from the predetermined low pressure to a predetermined high pressure at a stroke and supplying slurry to pass through the hole of the workpiece. Defects such as undercutting can be prevented by gradually increasing the slurry supply pressure and setting the slurry supply pressure in the early stage of polishing to a low pressure.

Inventors:

MINOSHIMA TAKAYUKI
SUGIURA SHINICHI
YAMAMOTO TAKASHI
MIYABE YASUNORI

Application Number:

JP2003421467A

Publication Date:

July 07, 2005

Filing Date:

December 18, 2003

Export Citation:

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Assignee:

DENSO CORP

International Classes:

B24B5/48; B24B9/00; B24B31/00; (IPC1-7): B24B31/00; B24B5/48; B24B9/00

Attorney, Agent or Firm:

Atsushi Aoki
Jun Tsuruta
Shinozaki Masami
Masaya Nishiyama

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